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Diffuse copper

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Product Description

Compared with oxygen-free copper materials, dispersed copper has higher hardness (HV>125) and higher strength (tensile strength>350MPa), while the corresponding data of oxygen-free copper is HV40,250MPa. And has a higher softening temperature.

Product Features

 

Brand

Melting point

 Softening temperature

Density g/cm3

 Thermal expansion coefficient (10-6/K) Thermal conductivity W/(M.K)

C15715

1083 ℃

800 ℃

8.84

365

17.6

C1560

1083 ℃

910 ℃

8.81

322

17.6

 

Comparison of the composition and physical properties of various types of dispersed copper and oxygen-free copper (at room temperature, unless otherwise specified).

UNS

Number of alloys

 Alumina content

Melting point

Density g/cm3
lb/in3

 Electrical conductivity

Thermal conductivity W/(M.K)

Thermal expansion coefficient
(range 20-150℃,
68-300 oF)

 Elastic modulus

OFC

0 %

1,083℃
(1,981 oF)

8.94
(0.323)

58 Meg S/m
(101 % IACS)

391 wat/m/OK
(226 BTU/ft/hr/OF)

17.7 μm/m/℃
(9.8 μ-in/in/OF)

115GPa
(17 Mpsi)

UNS-
C15715

0.3 wt. %

1,083℃
(1,981 oF)

8.90
(0.321)

54 Meg S/m
(92 % IACS)

365 wat/m/OK
(211 BTU/ft/hr/OF)

16.6μm/m/℃
(9.2 μ-in/in/OF)

130GPa
(19 Mpsi)

UNS-
C15760

1.1 wt. %

1,083℃
(1,981 oF)

8.81
(0.318)

45Meg S/m
(78 % IACS)

322 wat/m/OK
(186 BTU/ft/hr/OF)

16.6μm/m/℃
(9.2 μ-in/in/OF)

130GPa
(19 Mpsi)

 

If you need to reduce the thermal expansion rate, you can add other materials or elements. Adding them at high room temperature and high-intensity heating will increase the hardness.

Adding Glid AL-60 and 10% niobium to the composite material can improve the strength and conductivity of the material. Its hardness is equivalent to most copper-beryllium and copper-tungsten alloys, and its conductivity is comparable to all RWMA2 levels.








 

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