Product Center
Copper/molybdenum copper/copper (CPC)
Similar to copper/molybdenum/copper (CMC), copper/molybdenum-copper/copper is also a sandwich structure. It consists of two sub-layers-copper (Cu) and a core layer-molybdenum copper alloy (MoCu), which is in the X area It has a different thermal expansion coefficient from the Y area. Compared with tungsten copper, molybdenum copper and copper/molybdenum/copper materials, copper-molybdenum-copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price.
Advantages of copper/molybdenum copper/copper (CPC) electronic packaging materials:
1. Higher thermal conductivity than CMC
2. Can be punched into parts, reducing costs
3. The interface is firmly bonded and can withstand the impact of 850℃ high temperature repeatedly
4. Designable thermal expansion coefficient, matching with materials such as semiconductors and ceramics
5. Non-magnetic
Performance:
|
Brand |
Density g/cm3 |
Coefficient of thermal expansion×10-6 CTE (20℃) | Thermal conductivity W/(M·K) |
|
CPC141 |
9.5 |
7.3 |
211 |
|
CPC111 |
9.2 |
9.5 |
260 |
|
CPC232 |
9.3 |
7.5 |
250 |
Application:
With designable thermal expansion coefficient and thermal conductivity, copper/molybdenum copper/copper (CPC) is used as substrate and flange for RF, microwave and semiconductor high-power devices.
Previous
Next
86 13823152377
Nuclear energy Nuclear power Nuclear industry
High temperature heat container
Microelectronics industry Chip thermal sink
Semiconductor equipment MOCVD thermal field
High efficiency & long life Wire for wire cutting
Medical equipment Medical instruments
Artificial bone joint Bioimplantation
Rare metal cultural & creative art collection Precious metal
Plasma|Special Welding Electrode
3D printing|metal MIM Plasma sprayingLaser cladding With po
Copyright © Pioneer Technology Industries Co., Ltd All Rights Reserved. 粤ICP备19022711号