Product Center
Tungsten Copper
ungsten-copper electronic packaging material has both the low expansion characteristics of tungsten and the high thermal conductivity of copper. What is particularly valuable is that its coefficient of thermal expansion and thermal conductivity can be designed by adjusting the composition of the material, thus giving the material its application Brings great convenience.
Our company uses high-purity and high-quality raw materials, after pressing and forming, high-temperature sintering and infiltration, WCu electronic packaging materials and heat sink materials with excellent performance are obtained.
Tungsten Copper (WCu) electronic packaging material advantages:
1. Tungsten copper electronic packaging materials have adjustable thermal expansion coefficients, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.);
2. No sintering activation elements are added, maintaining good thermal conductivity;
3. Low porosity and good air tightness of the product;
4. Good size control, surface finish and flatness.
5. Provide sheets and molded parts, which can also meet electroplating needs.
Performance:
|
Brand |
Tungsten content Wt% |
Density g/cm3 |
Thermal expansion coefficient ×10-6 CTE（20℃） |
Thermal Conductivity W/（M·K） |
|
90WCu |
90±2% |
17.0 |
6.5 |
180 (25℃) /176 (100℃) |
|
85WCu |
85±2% |
16.4 |
7.2 |
190 (25℃)/ 183 (100℃) |
|
80WCu |
80±2% |
15.65 |
8.3 |
200 (25℃) / 197 (100℃) |
|
75WCu |
75±2% |
14.9 |
9.0 |
230 (25℃) / 220 (100℃) |
|
50WCu |
50±2% |
12.2 |
12.5 |
340 (25℃) / 310 (100℃) |
Application:
Materials suitable for packaging with high-power devices, such as substrates, bottom electrodes, etc.; high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.
Next
86 13823152377
Nuclear energy Nuclear power Nuclear industry
High temperature heat container
Microelectronics industry Chip thermal sink
Semiconductor equipment MOCVD thermal field
High efficiency & long life Wire for wire cutting
Medical equipment Medical instruments
Artificial bone joint Bioimplantation
Rare metal cultural & creative art collection Precious metal
Plasma|Special Welding Electrode
3D printing|metal MIM Plasma sprayingLaser cladding With po
Copyright © Pioneer Technology Industries Co., Ltd All Rights Reserved. 粤ICP备19022711号